Keyboard circuit trace restoration using conductive silver paste for computer input devices
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Abstract
Computer keyboards serve as essential input devices that translate user actions into digital signals. One common failure mechanism in keyboard membranes involves broken or degraded circuit traces, which leads to non-functional keys. This study investigates the restoration of such traces using conductive silver paste. An experimental approach was adopted, involving the repair of damaged traces on flexible membrane keyboard PCBs, followed by electrical testing and durability observation. The measurement outcomes indicate that silver paste offers approximately 7% higher electrical conductivity relative to copper, with measured resistivity at 15.87 nΩ·m and thermal conductivity reaching 430 W/m·K. Open circuit conditions (infinite resistance) were successfully restored to functional conductive paths showing 3.5 ± 0.8 Ω resistance after paste application and controlled heat curing. The post-repair resistance represents only a 25% increase compared to the original intact trace value of 2.8 ± 0.5 Ω, which remains well within the acceptable range for digital keyboard applications. This research contributes practical guidance for computer hardware maintenance personnel and researchers focused on input device reliability, while also supporting sustainable practices through repair-based lifecycle extension
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How to Cite
Muchlishiin, M. ., Matondang, A. A. ., Cholish, C., Astarani, T. F. ., & Sinambela, H. . (2026). Keyboard circuit trace restoration using conductive silver paste for computer input devices. Journal of Intelligent Decision Support System (IDSS), 9(2), 81-88. https://doi.org/10.35335/idss.v9i2.364
References
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Wünscher, S., Abbel, R., Perelaer, J., & Schubert, U. S. (2014). Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices. J. Mater. Chem. C, 2(48), 10232–10261. https://doi.org/10.1039/C4TC01820F
Z Zumhari, Hutajulu, E., Sibarani, B., Sirait, R., Anggriani, T., & Matondang, A. A. (2025). Advancing Environmental and Health Pollution Monitoring in Medan, Indonesia: A Mechatronics-Based Meta-Analysis. Journal of Geoscience, Engineering, Environment, and Technology, 10(3), 402–407. https://doi.org/10.25299/jgeet.2025.10.3.24694
Zhang, J., Ahmadi, M., Fargas, G., Perinka, N., Reguera, J., Lanceros-Méndez, S., Llanes, L., & Jiménez-Piqué, E. (2022). Silver Nanoparticles for Conductive Inks: From Synthesis and Ink Formulation to Their Use in Printing Technologies. Metals, 12(2), 234. https://doi.org/10.3390/met12020234
Zheng, P., Dong, W., Chang, V., Liu, Y., Li, G., Ji, C., & Li, M. (2010). Ag Migration Induced Reliability Concern on Micro-Electro-Mechanical Structure. ECS Transactions, 27(1), 269–273. https://doi.org/10.1149/1.3360630
Zikulnig, J., Chang, S., Bito, J., Rauter, L., Roshanghias, A., Carrara, S., & Kosel, J. (2023). Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems. Advanced Sensor Research, 2(8). https://doi.org/10.1002/adsr.202300075
Fritsch, J., Schumm, B., Biedermann, R., Grothe, J., & Kaskel, S. (2012). A New Silver‐Based Precursor as Ink for Soft Printing Techniques. European Journal of Inorganic Chemistry, 2012(5), 878–883. https://doi.org/10.1002/ejic.201100930
Garakani, B., Sandakelum Somarathna, K. U., Weerawarne, D. L., Poliks, M. D., & Alizadeh, A. (2019). Reliability of screen-printed conductors and resistors during fatigue cycling on flexible substrate. International Symposium on Microelectronics, 2019(1), 000139–000146. https://doi.org/10.4071/2380-4505-2019.1.000139
Hardi, S., Matondang, A. A., & Rambe, A. H. (2021). Modeling of transient caused by lightning strike at Nias high voltage substation using ATP-EMTP case study. Journal of Physics: Conference Series, 1811(1), 012049. https://doi.org/10.1088/1742-6596/1811/1/012049
Hasan, S., Suherman, & Muchlishiin, M. (2021). Voltage - Current Waveforms Of Single-phase Power Transformer Due To DC Bias. Journal of Physics: Conference Series, 1811(1), 012080. https://doi.org/10.1088/1742-6596/1811/1/012080
Ibrahim, N., Akindoyo, J. O., & Mariatti, M. (2022). Recent development in silver-based ink for flexible electronics. Journal of Science: Advanced Materials and Devices, 7(1), 100395. https://doi.org/10.1016/j.jsamd.2021.09.002
Jayasiri, G., Herat, S., & Kaparaju, P. (2024). Repair and Reuse or Recycle: What Is Best for Small WEEE in Australia? Sustainability, 16(7), 3035. https://doi.org/10.3390/su16073035
Kamyshny, A., & Magdassi, S. (2014). Conductive Nanomaterials for Printed Electronics. Small, 10(17), 3515–3535. https://doi.org/10.1002/smll.201303000
keyboard Improving quality. (2001). 23, 733–736.
Li, H., Zhu, X., Li, Z., Yang, J., & Lan, H. (2020). Preparation of Nano Silver Paste and Applications in Transparent Electrodes via Electric-Field Driven Micro-Scale 3D Printing. Nanomaterials, 10(1), 107. https://doi.org/10.3390/nano10010107
Matsuhisa, N., Chen, X., Bao, Z., & Someya, T. (2019). Materials and structural designs of stretchable conductors. Chemical Society Reviews, 48(11), 2946–2966. https://doi.org/10.1039/C8CS00814K
Nayak, L., Mohanty, S., Nayak, S. K., & Ramadoss, A. (2019). A review on inkjet printing of nanoparticle inks for flexible electronics. Journal of Materials Chemistry C, 7(29), 8771–8795. https://doi.org/10.1039/C9TC01630A
Perelaer, J., Smith, P. J., Mager, D., Soltman, D., Volkman, S. K., Subramanian, V., Korvink, J. G., & Schubert, U. S. (2010). Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials. Journal of Materials Chemistry, 20(39), 8446. https://doi.org/10.1039/c0jm00264j
Purba, A. M., Napitu, D. H. S., Lestari, M. W., Simangunsong, J., Hutajulu, E., Hutabarat, N. F., & Matondang, A. A. (2026). Energy Consumption and Charging Infrastructure Analysis for Electric Bus Deployment in Urban Transportation Systems. Jurnal Penelitian Pendidikan IPA, 12(4), 639–648. https://doi.org/10.29303/jppipa.v12i4.11221
R., V. K. R., K., V. A., P. S., K., & Singh, S. P. (2015). Conductive silver inks and their applications in printed and flexible electronics. RSC Advances, 5(95), 77760–77790. https://doi.org/10.1039/C5RA12013F
Ramsey, B. J., Evans, P. S. A., & Harrison, D. (n.d.). Conductive lithographic films. Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment. ISEE-1997, 252–256. https://doi.org/10.1109/ISEE.1997.605330
S Suparmono, C Cholish, A Abdullah, Sinambela, H., Alda, T., Matondang, A. A., & Simanjuntak, A. V. (2025). Quantitative Assessment of Passive Load Balancing for a Designed HVAC Installation: Case study in Magnificent Hall, Deli Park. Journal of Geoscience, Engineering, Environment, and Technology, 10(3), 397–401. https://doi.org/10.25299/jgeet.2025.10.3.24696
Sitorus, N., Ginting, B. B., Panjaitan, B. P., Simanjuntak, B. E., Naibaho, P. R. P., Matondang, A. A., & Simanjuntak, A. V. H. (2025). Design and Performance Evaluation of a 200 Wp Off-Grid Solar Photovoltaic Module for Renewable Energy in Indonesia. Journal of Geoscience, Engineering, Environment, and Technology, 10(3), 408–412. https://doi.org/10.25299/jgeet.2025.10.3.24981
Sun, Q., Qian, B., Uto, K., Chen, J., Liu, X., & Minari, T. (2018). Functional biomaterials towards flexible electronics and sensors. Biosensors and Bioelectronics, 119, 237–251. https://doi.org/10.1016/j.bios.2018.08.018
Valdec, D., Hajdek, K., Majnarić, I., & Čerepinko, D. (2021). Influence of Printing Substrate on Quality of Line and Text Reproduction in Flexography. Applied Sciences, 11(17), 7827. https://doi.org/10.3390/app11177827
Wang, S., Wu, X., Lu, J., Luo, Z., Xie, H., Zhang, X., Lin, K., & Wang, Y. (2022). Inkjet-Printed Silver Nanowire Ink for Flexible Transparent Conductive Film Applications. Nanomaterials, 12(5). https://doi.org/10.3390/nano12050842
Wu, X., Zhou, Z., Wang, Y., & Li, J. (2020). Syntheses of Silver Nanowires Ink and Printable Flexible Transparent Conductive Film: A Review. Coatings, 10(9), 865. https://doi.org/10.3390/coatings10090865
Wünscher, S., Abbel, R., Perelaer, J., & Schubert, U. S. (2014). Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices. J. Mater. Chem. C, 2(48), 10232–10261. https://doi.org/10.1039/C4TC01820F
Z Zumhari, Hutajulu, E., Sibarani, B., Sirait, R., Anggriani, T., & Matondang, A. A. (2025). Advancing Environmental and Health Pollution Monitoring in Medan, Indonesia: A Mechatronics-Based Meta-Analysis. Journal of Geoscience, Engineering, Environment, and Technology, 10(3), 402–407. https://doi.org/10.25299/jgeet.2025.10.3.24694
Zhang, J., Ahmadi, M., Fargas, G., Perinka, N., Reguera, J., Lanceros-Méndez, S., Llanes, L., & Jiménez-Piqué, E. (2022). Silver Nanoparticles for Conductive Inks: From Synthesis and Ink Formulation to Their Use in Printing Technologies. Metals, 12(2), 234. https://doi.org/10.3390/met12020234
Zheng, P., Dong, W., Chang, V., Liu, Y., Li, G., Ji, C., & Li, M. (2010). Ag Migration Induced Reliability Concern on Micro-Electro-Mechanical Structure. ECS Transactions, 27(1), 269–273. https://doi.org/10.1149/1.3360630
Zikulnig, J., Chang, S., Bito, J., Rauter, L., Roshanghias, A., Carrara, S., & Kosel, J. (2023). Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems. Advanced Sensor Research, 2(8). https://doi.org/10.1002/adsr.202300075
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